GlobalFoundries VP details FDX Fusion technology, sporting 7nm-class performance without the need for EUV tools — company targets 2030 for high-volume manufacturing, with planar transistors in tow
GlobalFoundries reveals new details about its FDX Fusion technology, which promises 7nm-class performance and 8nm-class logic density using planar FD-SOI transistors without EUV lithography, shares what is next for FDX Fusion node, and the FDX program in…
Adjust this page to suit you. Your choices are saved in this browser.
Cookies. Chipokia uses one cookie, and only if you allow it: a random ID so your up and down votes stay yours. No analytics, no advertising, no tracking of any kind. Privacy & Cookie Policy.
