Microsoft Maia 300 Puts 288GB of HBM4 at 18TB/s on an N2P Chiplet and 96 Accelerators in a 167kW Rack
Microsoft unveiled Azure Maia 300 today at the OCP Global Summit, the third generation of its in-house inference accelerator and the first built as a multi-chiplet part. Each accelerator pairs a TSMC N2P compute die with eight HBM4 stacks for 288GB of memory…
Adjust this page to suit you. Your choices are saved in this browser.
Cookies. Chipokia uses one cookie, and only if you allow it: a random ID so your up and down votes stay yours. No analytics, no advertising, no tracking of any kind. Cookie & Privacy Policy.