Demand & Complexities Of AI GPUs And Custom ASICs Have Stressed TSMC’s CoWoS Supply, Reportedly Sparking The Possibility Of A 20% Price Hike
TSMC’s CoWoS advanced packaging technology could witness another price increase, with supply chain sources suggesting a hike of up to 20 percent being discussed. The potential premium expected to be slapped on the packaging stems from demand adjustment, as AI…
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